EJOT TSSD®

Specification

Overview
- Fastening element and process specifically for sandwich elements
- Broad application range
- Especially suitable for honeycomb structures
- High transmittable tensile forces
- No corrosion
- Can be used as screw boss or as direct fastening element

Downloads

EJOT_TSSD_Flyer_01.23_en.pdf 270 KB

Niko Müller

Product Manager

nmueller@ejot.com
+49 2751 529 - 5959

CAD & more on ejot.com

With the one-time registration we provide in this area CAD data in various formats as well as PDFs of the technical drawings of our products DELTA PT^®, SHEETtracs^® and ALtracs^® Plus.

Additionally, CAD & more offers you the possibility to design your individual joints with the aid of prognosis programs or to check their feasibility by APPLICATION CHECKs. Furthermore, you can download the latest product brochures, technical publications and the EJOT company standards.

CAD & more

The EJOT TSSD^® thermal adhesive bonding boss

The EJOT TSSD^® (thermal adhesive bonding boss) product and corresponding joining process have been developed with the objective to join components of which one is made of fibre-reinforced plastics.
The process is suitable for sandwich elements with honeycomb and foam core structures (having different top coats) as well as for CRP and GRP plastic materials.
During the joining process the plastic boss (made of thermoplastic) is installed into the plastic component with a certain rotation speed and axial load.

TSSD^® APPLICATION CHECK

For process reliable fastening of components in honeycomb and foam core structures with different cover layers, EJOT has developed the "TSSD" (thermal adhesive bonding boss), an innovative product including joining process. For the TSSD^® joining process, a new online tool is now available, where the user can find standard values which are based on numerous trials.